CPC Unveils Full-Flow Connectors for AI Data Center Cooling

System engineers facing the intense heat loads of modern compute platforms are increasingly moving toward liquid cooling to maintain performance. The Everis DC Series addresses this demand with a design that eliminates the flow restrictions common in standard connectors. By minimizing the pressure drop, the hardware allows data centers to decrease the energy draw required by pumps and coolant distribution units, directly impacting operating costs.

Beyond efficiency, the series emphasizes physical integration. The connectors feature a lower profile than traditional valved counterparts, enabling direct mounting into manifolds or cold plates. This is particularly vital for high-density 1U server trays where space is at a premium. Constructed from 304 stainless steel and manufactured in cleanroom environments, the units are built for high-purity applications. The product family offers both in-line and elbow configurations, incorporating a swivel design to provide the mechanical flexibility that rigid, hard-plumbed systems lack. Patrick Gerst, General Manager of CPC’s thermal business unit, noted that the product is engineered to support both current cooling requirements and the evolving needs of next-generation compute architectures. The company plans to debut the series at the Open Compute Project APAC Summit, scheduled for August 11-12 in Taipei.