The 29th edition of the show moves beyond traditional display hardware, focusing heavily on the intersection of photonics and artificial intelligence. Key highlights include dedicated zones for AI+AR smart glasses and Micro LED optical interconnects. These areas serve as a hub for companies specializing in spatial computing, chips, and optical-module glass substrates, signaling a shift toward high-speed data centers and advanced wearable devices.
A central feature of this year’s exhibition is the TGV Glass Substrate Manufacturing Demonstration Line. By providing a live, end-to-end view of the through-glass via process, organizers aim to bridge the gap between material providers, equipment manufacturers, and semiconductor packaging firms. This hands-on approach is designed to accelerate the commercialization of technologies that support next-generation intelligent mobility and industrial inspection.





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